@phdthesis{Mueller2022,
  author    = {M{\"u}ller, Valentin Leander},
  title     = {Transport signatures of topological and trivial states in the three-dimensional topological insulator HgTe},
  doi       = {10.25972/OPUS-25952},
  url       = {http://nbn-resolving.de/urn:nbn:de:bvb:20-opus-259521},
  school      = {Universit{\"a}t W{\"u}rzburg},
  year      = {2022},
  abstract  = {The thesis at hand is concerned with improving our understanding of and our control over transport properties of the three-dimensional topological insulator HgTe. Topological insulators are characterized by an insulating bulk and symmetry-protected metallic surface states. These topological surface states hold great promise for research and technology; at the same time, many properties of experimentally accessible topological insulator materials still need to be explored thoroughly. The overall aim of this thesis was to experimentally investigate micrometer-sized HgTe transport devices to observe the ballistic transport regime as well as intercarrier scattering and possibly identify special properties of the topological surface states. Part I of the thesis presents lithographic developments concerned with etching small HgTe devices. The aim was to replace existing processes which relied on dry etching with high-energy \(\text{Ar}^+\) ions and an organic etch mask. This etching method is known to degrade the HgTe crystal quality. In addition, the etch mask turned out to be not durable for long etching processes and difficult to remove completely after etching. First, \(\text{BaF}_2\) was introduced as a new etch mask for dry etching to replace the organic etch mask. With common surface characterization techniques like SEM and XPS it was shown that \(\text{BaF}_2\) etch masks are easy to deposit, highly durable in common dry etching processes for \(\text{Hg}_{1-x}\text{Cd}_x\text{Te}\), and easy to remove in deionized water. Transport results of HgTe devices fabricated with the new etch mask are comparable to results obtained with the old process. At the same time, the new etch mask can withstand longer etching times and does not cause problems due to incomplete removal. Second, a new inductively coupled plasma dry etching process based on \(\text{CH}_4\) and Ar was introduced. This etching process is compatible with \(\text{BaF}_2\) etch masks and yields highly reproducible results. Transport results indicate that the new etching process does not degrade the crystal quality and is suitable to produce high-quality transport devices even in the micrometer range. A comparison with wet-etched samples shows that inductively coupled plasma etching introduces a pronounced edge roughness. This - usually undesirable - property is actually beneficial for some of the experiments in this study and mostly irrelevant for others. Therefore, most samples appearing in this thesis were fabricated with the new process. Part II of the thesis details the advancements made in identifying topological and trivial states which contribute to transport in HgTe three-dimensional topological insulators. To this end, macroscopic Hall bar samples were fabricated from high-quality tensilely strained HgTe layers by means of the improved lithographic processes. All samples were equipped with a top gate electrode, and some also with a modulation doping layer or a back gate electrode to modify the carrier density of the surface states on both sides of the HgTe layer. Due to the high sample quality, Landau levels could be well-resolved in standard transport measurements down to magnetic fields of less than 0.5T. High-resolution measurements of the Landau level dispersion with gate voltage and magnetic field allowed disentangling different transport channels. The main result here is that the upper (electron) branches of the two topological surface states contribute to transport in all experimentally relevant density regimes, while the hole branch is not accessible. Far in n-regime bulk conduction band states give a minor contribution to transport. More importantly, trivial bulk valence band holes come into play close to the charge neutrality point. Further in p-regime, the strong applied gate voltage leads to the formation of two-dimensional, massive hole states at the HgTe surface. The interplay of different states gives rise to rich physics: Top gate-back gate maps revealed that an anticrossing of Landau levels from the two topological surface states occurs at equal filling. A possible explanation for this effect is a weak hybridization of the surface states; however, future studies need to further clarify this point. Furthermore, the superposition of n-type topological and p-type trivial surface states leads to an intriguing Landau level dispersion. The good quantization of the Hall conductance in this situation indicates that the counterpropagating edge states interact with each other. The nature of this interaction will be the topic of further research. Part III of the thesis is focused on HgTe microstructures. These "channel samples" have a typical width of 0.5 to 4µm and a typical length of 5 to 80µm. The quality of these devices benefits particularly from the improved lithographic processes. As a result, the impurity mean free path of the topological surface state electrons is on the order of the device width and transport becomes semiballistic. This was verified by measuring the channel resistance in small magnetic fields in n-regime. The deflection of carriers towards the dissipative channel walls results in a pronounced peak in the magnetoresistance, which scales in a predictable manner with the channel width. To investigate transport effects due to mutual scattering of charge carriers, the differential resistance of channel samples was measured as a function of carrier temperature. Selective heating of the charge carriers - but not the lattice - was achieved by passing a heating current through the channel. Increasing the carrier temperature has two pronounced effects when the Fermi level is situated in proximity to the bulk valence band maximum where the density of states is large. First, when both topological surface state electrons and bulk holes are present, electron-hole scattering leads to a pronounced increase in resistance with increasing carrier temperature. Second, a thermally induced increase of the electron and hole carrier densities reduces the resistance again at higher temperatures. A model considering these two effects was developed, which can well reproduce the experimental results. Current heating experiments in zero-gap HgTe quantum wells and compressively strained HgTe layers are consistent with this model. These observations raise the question as to how electron-hole scattering may affect other transport properties of HgTe-based three-dimensional topological insulators, which is briefly discussed in the outlook.},
  subject      = {Topologischer Isolator},
  language  = {en}
}