@phdthesis{Bendias2018,
  author    = {Bendias, Michel Kalle},
  title     = {Quantum Spin Hall Effect - A new generation of microstructures},
  url       = {http://nbn-resolving.de/urn:nbn:de:bvb:20-opus-168214},
  school      = {Universit{\"a}t W{\"u}rzburg},
  year      = {2018},
  abstract  = {The presented thesis summarizes the results from four and a half years of intense lithography development on (Cd,Hg)Te/HgTe/(Cd,Hg)Te quantum well structures. The effort was motivated by the unique properties of this topological insulator. Previous work from Molenkamp at al.\ has proven that the transport through such a 2D TI is carried by electrons with opposite spin, counter-propagating in 1D channels along the sample edge. However, up to this thesis, the length of quantized spin Hall channels has never been reported to exceed 4 µm. Therefore, the main focus was put on a reproducible and easy-to-handle fabrication process that reveals the intrinsic material parameters. Every single lithography step in macro as well as microscopic sample fabrication has been re-evaluated. In the Development, the process changes have been presented along SEM pictures, microgaphs and, whenever possible, measurement responses. We have proven the conventional ion milling etch method to damage the remaining mesa and result in drastically lower electron mobilities in samples of microscopic size. The novel KI:I2:HBr wet etch method for macro and microstructure mesa fabrication has been shown to leave the crystalline structure intact and result in unprecedented mobilities, as high as in macroscopic characterization Hall bars. Difficulties, such as an irregular etch start and slower etching of the conductive QW have been overcome by concentration, design and etch flow adaptations. In consideration of the diffusive regime, a frame around the EBL write field electrically decouples the structure mesa from the outside wafer. As the smallest structure, the frame is etched first and guarantees a non-different etching of the conductive layer during the redox reaction. A tube-pump method assures reproducible etch results with mesa heights below 300 nm. The PMMA etch mask is easy to strip and leaves a clean mesa with no redeposition. From the very first attempts, to the final etch process, the reader has been provided with the characteristics and design requirements necessary to enable the fabrication of nearly any mesa shape within an EBL write field of 200 µm. Magneto resistance measurement of feed-back samples have been presented along the development chronology of wet etch method and subsequent lithography steps. With increasing feature quality, more and more physics has been revealed enabling detailed evaluation of smallest disturbances. The following lithography improvements have been implemented. They represent a tool-box for high quality macro and microstructure fabrication on (CdHg)Te/HgTe of almost any kind. The optical positive resist ECI 3027 can be used as wet and as dry etch mask for structure sizes larger than 1 µm. It serves to etch mesa structures larger than the EBL write field. The double layer PMMA is used for ohmic contact fabrication within the EBL write field. Its thickness allows to first dry etch the (Cd,Hg)Te cap layer and then evaporate the AuGe contact, in situ and self-aligned. Because of an undercut, up to 300 nm can be metalized without any sidewalls after the lift-off. An edge channel mismatch within the contact leads can be avoided, if the ohmic contacts are designed to reach close to the sample and beneath the later gate electrode. The MIBK cleaning step prior to the gate application removes PMMA residuals and thereby improves gate and potential homogeneity. The novel low HfO2-ALD process enables insulator growth into optical and EBL lift-off masks of any resolvable shape. Directly metalized after the insulator growth, the self-aligned method results in thin and homogeneous gate electrode reproducibly withholding gate voltages to +-10 V. The optical negative resist ARN 4340 exhibits an undercut when developed. Usable as dry etch mask and lift-off resist, it enables an in-situ application of ohmic contacts first etching close to the QW, then metalizing AuGe. Up to 500 nm thickness, the undercut guarantees an a clean lift-off with no sidewalls. The undertaken efforts have led to micro Hall bar measurements with Hall plateaus and SdH-oszillations in up to now unseen levels of detail. The gap resistance of several micro Hall bars with a clear QSH signal have been presented in Quantum Spin Hall. The first to exhibit longitudinal resistances close to the expected h/2e2 since years, they reveal unprecedented details in features and characteristics. It has been shown that their protection against backscattering through time reversal symmetry is not as rigid as previously claimed. Values below and above 12.9 kΩ been explained, introducing backscattering within the Landauer-B{\"u}ttiker formalism of edge channel transport. Possible reasons have been discussed. Kondo, interaction and Rashba-backscattering arising from density inhomogeneities close to the edge are most plausible to explain features on and deviations from a quantized value. Interaction, tunneling and dephasing mechanisms as well as puddle size, density of states and Rashba Fields are gate voltage dependent. Therefore, features in the QSH signal are fingerprints of the characteristic potential landscape. Stable up to 11 K, two distinct but clear power laws have been found in the higher temperature dependence of the QSH in two samples. However, with ΔR = Tα, α = ¼ in one (QC0285) and α = 2 in the other (Q2745), none of the predicted dependencies could be confirmed. Whereas, the gap resistances of QC0285 remains QSH channel dominated up to 3.9 T and thereby confirmed the calculated lifting of the band inversion in magnetic field. The gate-dependent oscillating features in the QSH signal of Q2745 immediately increase in magnetic field. The distinct field dependencies allowed the assumption of two different dominant backscattering mechanisms. Resulting in undisturbed magneto transport and unprecedented QSH measurements The Novel Micro Hall Bar Process has proven to enable the fabrication of a new generation of microstructures.},
  subject      = {Quecksilbertellurid},
  language  = {en}
}