73.00.00 Electronic structure and electrical properties of surfaces, interfaces, thin films, and low-dimensional structures (for electronic structure and electrical properties of superconducting films and low-dimensional structures, see 74.78.-w; for computational
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The subject of this thesis is the investigation of the transport properties of topological and massive surface states in the three-dimensional topological insulator Hg(Mn)Te. These surface states give rise to a variety of extraordinary transport phenomena, making this material system of great interest for research and technological applications. In this connection, many physical properties of the topological insulator Hg(Mn)Te still require in-depth exploration. The overall aim of this thesis is to analyze the quantum transport of HgTe-based devices ranging from hundreds of micrometers (macroscopic) down to a few micrometers in size (microscopic) in order to extend the overall understanding of surface states and the possibilities of their manipulation.
In order to exploit the full potential of our high-quality heterostructures, it was necessary to revise and improve the existing lithographic fabrication process of macroscopic three-dimensional Hg(Mn)Te samples. A novel lithographic standard recipe for the fabrication of the HgTe-based macrostructures was developed. This recipe includes the use of an optimized Hall bar design and wet etching instead of etching with high-energy \(\mathrm{{Ar^{+}}}\)-ions, which can damage the samples. Further, a hafnium oxide insulator is applied replacing the SiO\(_{2}\)/Si\(_{3}\)N\(_{4}\) dielectric in order to reduce thermal load. Moreover, the devices are metallized under an alternating angle to avoid discontinuities of the metal layers over the mesa edges. It was revealed that the application of gate-dielectric and top-gate metals results in n-type doping of the devices. This phenomenon could be attributed to quasi-free electrons tunneling from the trap states, which form at the interface cap layer/insulator, through the cap into the active layer. This finding led to the development of a new procedure to characterize wafer materials. It was found that the optimized lithographic processing steps do not unintentionally react chemically with our heterostructures, thus avoiding a degradation of the quality of the Hg(Mn)Te layer. The implementation of new contact structures Ti/Au, In/Ti/Au, and Al/Ti/Au did not result in any improvement compared to the standard structure AuGe/Au. However, a novel sample recipe could be developed, resulting in an intermixing of the contact metals (AuGe and Au) and fingering of metal into the mesa. The extent of the quality of the ohmic contacts obtained through this process has yet to be fully established.
This thesis further deals with the lithographic realization of three-dimensional HgTe-based microstructures measuring only a few micrometer in size. Thus, these structures are in the order of the mean free path and the spin relaxation length of topological surface state electrons. A lithographic process was developed enabling the fabrication of nearly any desired microscopic device structure. In this context, two techniques suitable for etching microscopic samples were realized, namely wet etching and the newly established inductively coupled plasma etching. While wet etching was found to preserve the crystal quality of the active layer best, inductively coupled plasma etching is characterized by high reproducibility and excellent structural fidelity. Hence, the etching technique employed depends on the envisaged type of experiment.
Magneto-transport measurements were carried out on the macroscopic HgTe-based devices fabricated by means of improved lithographic processing with respect to the transport properties of topological and massive surface states. It was revealed that due to the low charge carrier density present in the leads to the ohmic contacts, these regions can exhibit an insulating behavior at high magnetic fields and extremely low temperatures. As soon as the filling factor of the lowest Landau levels dropped below a critical value (\(\nu_{\mathrm{{c}}}\approx0.8\)), the conductance of the leads decreased significantly. It was demonstrated that the carrier density in the leads can be increased by the growth of modulation doping layers, a back-gate-electrode, light-emitting diode illumination, and by the application of an overlapping top-gate layout. This overlapping top-gate and a back-gate made it possible to manipulate the carrier density of the surface states on both sides of the Hg(Mn)Te layer independently. With this setup, it was identified that topological and massive surface states contribute to transport simultaneously in 3D Hg(Mn)Te. A model could be developed allowing the charge carrier systems populated in the sample to be determined unambiguously. Based on this model, the process of the re-entrant quantum Hall effect observed for the first time in three-dimensional topological insulators could be explained by an interplay of n-type topological and p-type massive surface states. A well-pronounced \(\nu=-1\rightarrow\nu=-2\rightarrow\nu=-1\) sequence of quantum Hall plateaus was found in manganese-doped HgTe-based samples. It is postulated that this is the condensed-matter realization of the parity anomaly in three-dimensional topological insulators. The actual nature of this phenomenon can be the subject of further research. In addition, the measurements have shown that inter-scattering occurs between counter-propagating quantum Hall edge states. The good quantization of the Hall conductance despite this inter-scattering indicates that only the unpaired edge states determine the transport properties of the system as a whole. The underlying inter-scattering mechanism is the topic of a publication in preparation.
Furthermore, three-dimensional HgTe-based microstructures shaped like the capital letter "H" were investigated regarding spin transport phenomena. The non-local voltage signals occurring in the measurements could be attributed to a current-induced spin polarization of the topological surface states due to electrons obeying spin-momentum locking. It was shown that the strength of this non-local signal is directly connected to the magnitude of the spin polarization and can be manipulated by the applied top-gate voltage. It was found that in these microstructures, the massive surface and bulk states, unlike the topological surface states, cannot contribute to this spin-associated phenomenon. On the contrary, it was demonstrated that the population of massive states results in a reduction of the spin polarization, either due to the possible inter-scattering of massive and topological surface states or due to the addition of an unpolarized electron background. The evidence of spin transport controllable by a top-gate-electrode makes the three-dimensional material system mercury telluride a promising candidate for further research in the field of spintronics.
The thesis at hand is concerned with improving our understanding of and our control over transport properties of the three-dimensional topological insulator HgTe. Topological insulators are characterized by an insulating bulk and symmetry-protected metallic surface states. These topological surface states hold great promise for research and technology; at the same time, many properties of experimentally accessible topological insulator materials still need to be explored thoroughly. The overall aim of this thesis was to experimentally investigate micrometer-sized HgTe transport devices to observe the ballistic transport regime as well as intercarrier scattering and possibly identify special properties of the topological surface states.
Part I of the thesis presents lithographic developments concerned with etching small HgTe devices. The aim was to replace existing processes which relied on dry etching with high-energy \(\text{Ar}^+\) ions and an organic etch mask. This etching method is known to degrade the HgTe crystal quality. In addition, the etch mask turned out to be not durable for long etching processes and difficult to remove completely after etching. First, \(\text{BaF}_2\) was introduced as a new etch mask for dry etching to replace the organic etch mask. With common surface characterization techniques like SEM and XPS it was shown that \(\text{BaF}_2\) etch masks are easy to deposit, highly durable in common dry etching processes for \(\text{Hg}_{1-x}\text{Cd}_x\text{Te}\), and easy to remove in deionized water. Transport results of HgTe devices fabricated with the new etch mask are comparable to results obtained with the old process. At the same time, the new etch mask can withstand longer etching times and does not cause problems due to incomplete removal. Second, a new inductively coupled plasma dry etching process based on \(\text{CH}_4\) and Ar was introduced. This etching process is compatible with \(\text{BaF}_2\) etch masks and yields highly reproducible results. Transport results indicate that the new etching process does not degrade the crystal quality and is suitable to produce high-quality transport devices even in the micrometer range. A comparison with wet-etched samples shows that inductively coupled plasma etching introduces a pronounced edge roughness. This - usually undesirable - property is actually beneficial for some of the experiments in this study and mostly irrelevant for others. Therefore, most samples appearing in this thesis were fabricated with the new process.
Part II of the thesis details the advancements made in identifying topological and trivial states which contribute to transport in HgTe three-dimensional topological insulators. To this end, macroscopic Hall bar samples were fabricated from high-quality tensilely strained HgTe layers by means of the improved lithographic processes. All samples were equipped with a top gate electrode, and some also with a modulation doping layer or a back gate electrode to modify the carrier density of the surface states on both sides of the HgTe layer. Due to the high sample quality, Landau levels could be well-resolved in standard transport measurements down to magnetic fields of less than 0.5T. High-resolution measurements of the Landau level dispersion with gate voltage and magnetic field allowed disentangling different transport channels. The main result here is that the upper (electron) branches of the two topological surface states contribute to transport in all experimentally relevant density regimes, while the hole branch is not accessible. Far in n-regime bulk conduction band states give a minor contribution to transport. More importantly, trivial bulk valence band holes come into play close to the charge neutrality point. Further in p-regime, the strong applied gate voltage leads to the formation of two-dimensional, massive hole states at the HgTe surface. The interplay of different states gives rise to rich physics: Top gate-back gate maps revealed that an anticrossing of Landau levels from the two topological surface states occurs at equal filling. A possible explanation for this effect is a weak hybridization of the surface states; however, future studies need to further clarify this point. Furthermore, the superposition of n-type topological and p-type trivial surface states leads to an intriguing Landau level dispersion. The good quantization of the Hall conductance in this situation indicates that the counterpropagating edge states interact with each other. The nature of this interaction will be the topic of further research.
Part III of the thesis is focused on HgTe microstructures. These "channel samples" have a typical width of 0.5 to 4µm and a typical length of 5 to 80µm. The quality of these devices benefits particularly from the improved lithographic processes. As a result, the impurity mean free path of the topological surface state electrons is on the order of the device width and transport becomes semiballistic. This was verified by measuring the channel resistance in small magnetic fields in n-regime. The deflection of carriers towards the dissipative channel walls results in a pronounced peak in the magnetoresistance, which scales in a predictable manner with the channel width. To investigate transport effects due to mutual scattering of charge carriers, the differential resistance of channel samples was measured as a function of carrier temperature. Selective heating of the charge carriers - but not the lattice - was achieved by passing a heating current through the channel. Increasing the carrier temperature has two pronounced effects when the Fermi level is situated in proximity to the bulk valence band maximum where the density of states is large. First, when both topological surface state electrons and bulk holes are present, electron-hole scattering leads to a pronounced increase in resistance with increasing carrier temperature. Second, a thermally induced increase of the electron and hole carrier densities reduces the resistance again at higher temperatures. A model considering these two effects was developed, which can well reproduce the experimental results. Current heating experiments in zero-gap HgTe quantum wells and compressively strained HgTe layers are consistent with this model. These observations raise the question as to how electron-hole scattering may affect other transport properties of HgTe-based three-dimensional topological insulators, which is briefly discussed in the outlook.